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5962-01-150-5623

20 Products

277-4005-136-02

MICROCIRCUIT ASSEMBLY

NSN, MFG P/N

5962011505623

NSN

5962-01-150-5623

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277-4005-136-02

MICROCIRCUIT ASSEMBLY

NSN, MFG P/N

5962011505623

NSN

5962-01-150-5623

MFG

GE AVIATION SYSTEMS LLC DBA GE AVIATION DIV INFORMATION SYSTEMS - GERMANTOWN

Description

SPECIAL FEATURES: 0.880 IN.LG;0.550 IN.W;0.170 IN.H;1 TYPE 4050;1 TYPE 4013;ELECTROSTATIC DEVICES;

SL41458

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962011504310

NSN

5962-01-150-4310

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SL41458

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962011504310

NSN

5962-01-150-4310

MFG

FAIRCHILD SEMICONDUCTOR CORP

Description

(NON-CORE DATA) BIT QUANTITY: 256
BODY LENGTH: 0.875 INCHES NOMINAL
BODY WIDTH: 0.250 INCHES NOMINAL
FEATURES PROVIDED: MONOLITHIC
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: GLASS AND METAL
INPUT CIRCUIT PATTERN: 5 INPUT
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC

962-15094

INTEGRATED CIRCUIT

NSN, MFG P/N

5962011504457

NSN

5962-01-150-4457

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962-15094

INTEGRATED CIRCUIT

NSN, MFG P/N

5962011504457

NSN

5962-01-150-4457

MFG

POWER PARAGON INC DBA POWER SYSTEMS GROUP DIV POWER SYSTEMS GROUP

3610193-001

INTEGRATED CIRCUIT

NSN, MFG P/N

5962011504459

NSN

5962-01-150-4459

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3610193-001

INTEGRATED CIRCUIT

NSN, MFG P/N

5962011504459

NSN

5962-01-150-4459

MFG

COHU INC

A584A121-101

MICROCIRCUIT,LINEAR

NSN, MFG P/N

5962011504630

NSN

5962-01-150-4630

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A584A121-101

MICROCIRCUIT,LINEAR

NSN, MFG P/N

5962011504630

NSN

5962-01-150-4630

MFG

KEARFOTT CORPORATION DBA KEARFOTT DIV GUIDANCE AND NAVIGATION DIVISION

Description

BODY HEIGHT: 0.185 INCHES MAXIMUM
BODY LENGTH: 0.405 INCHES MAXIMUM
BODY WIDTH: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM
DESIGN FUNCTION AND QUANTITY: 1 REFERENCE, VOLTAGE, ANALOG AND 1 DRIVER, LINE DIFFERENTIAL
FEATURES PROVIDED: MONOLITHIC AND HERMETICALLY SEALED
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC AND GLASS
INPUT CIRCUIT PATTERN: 3 INPUT
MAXIMUM POWER DISSIPATION RATING: 500.0 MILLIWATTS
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
STORAGE TEMP RANGE: -55.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: TIN
TEST DATA DOCUMENT: 88818-A584A121 DRAWING

REF02AZ/883B

MICROCIRCUIT,LINEAR

NSN, MFG P/N

5962011504630

NSN

5962-01-150-4630

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REF02AZ/883B

MICROCIRCUIT,LINEAR

NSN, MFG P/N

5962011504630

NSN

5962-01-150-4630

MFG

ANALOG DEVICES INC. DIV SANTA CLARA SITE

Description

BODY HEIGHT: 0.185 INCHES MAXIMUM
BODY LENGTH: 0.405 INCHES MAXIMUM
BODY WIDTH: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM
DESIGN FUNCTION AND QUANTITY: 1 REFERENCE, VOLTAGE, ANALOG AND 1 DRIVER, LINE DIFFERENTIAL
FEATURES PROVIDED: MONOLITHIC AND HERMETICALLY SEALED
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC AND GLASS
INPUT CIRCUIT PATTERN: 3 INPUT
MAXIMUM POWER DISSIPATION RATING: 500.0 MILLIWATTS
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
STORAGE TEMP RANGE: -55.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: TIN
TEST DATA DOCUMENT: 88818-A584A121 DRAWING

1A7862-1

MICROCIRCUIT,LINEAR

NSN, MFG P/N

5962011504631

NSN

5962-01-150-4631

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1A7862-1

MICROCIRCUIT,LINEAR

NSN, MFG P/N

5962011504631

NSN

5962-01-150-4631

MFG

GE AVIATIONS SYSTEMS LLC DBA GE AVIATION DIV ELECTRICAL POWER-POMPANO

Description

BODY HEIGHT: 0.185 INCHES MAXIMUM
BODY LENGTH: 0.840 INCHES MAXIMUM
BODY WIDTH: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM
DESIGN FUNCTION AND QUANTITY: 1 POWER SUPPLY
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND W/OPEN COLLECTOR AND W/RESISTOR
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 4 INPUT
MAXIMUM POWER DISSIPATION RATING: 1.0 WATTS
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
SPECIAL FEATURES: AVAILABLE IN "J" PACKAGE-16 PIN CERAMIC DIP OR "L" PACKAGE-20 PIN CERAMIC LEADLESS CHIP CARRIER
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: TIN
TEST DATA DOCUMENT: 97953-1A7862 DRAWING

4055297-0701

MICROCIRCUIT,LINEAR

NSN, MFG P/N

5962011504631

NSN

5962-01-150-4631

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4055297-0701

MICROCIRCUIT,LINEAR

NSN, MFG P/N

5962011504631

NSN

5962-01-150-4631

MFG

RAYTHEON COMPANY DBA RAYTHEON

Description

BODY HEIGHT: 0.185 INCHES MAXIMUM
BODY LENGTH: 0.840 INCHES MAXIMUM
BODY WIDTH: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM
DESIGN FUNCTION AND QUANTITY: 1 POWER SUPPLY
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND W/OPEN COLLECTOR AND W/RESISTOR
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 4 INPUT
MAXIMUM POWER DISSIPATION RATING: 1.0 WATTS
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
SPECIAL FEATURES: AVAILABLE IN "J" PACKAGE-16 PIN CERAMIC DIP OR "L" PACKAGE-20 PIN CERAMIC LEADLESS CHIP CARRIER
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: TIN
TEST DATA DOCUMENT: 97953-1A7862 DRAWING

477-1857-001

MICROCIRCUIT,LINEAR

NSN, MFG P/N

5962011504631

NSN

5962-01-150-4631

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477-1857-001

MICROCIRCUIT,LINEAR

NSN, MFG P/N

5962011504631

NSN

5962-01-150-4631

MFG

BOEING COMPANY THE DBA BOEING DIV DEFENSE SPACE & SECURITY - NETWORK & SPACE SYSTEMS

Description

BODY HEIGHT: 0.185 INCHES MAXIMUM
BODY LENGTH: 0.840 INCHES MAXIMUM
BODY WIDTH: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM
DESIGN FUNCTION AND QUANTITY: 1 POWER SUPPLY
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND W/OPEN COLLECTOR AND W/RESISTOR
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 4 INPUT
MAXIMUM POWER DISSIPATION RATING: 1.0 WATTS
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
SPECIAL FEATURES: AVAILABLE IN "J" PACKAGE-16 PIN CERAMIC DIP OR "L" PACKAGE-20 PIN CERAMIC LEADLESS CHIP CARRIER
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: TIN
TEST DATA DOCUMENT: 97953-1A7862 DRAWING

5371-569

MICROCIRCUIT,LINEAR

NSN, MFG P/N

5962011504631

NSN

5962-01-150-4631

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5371-569

MICROCIRCUIT,LINEAR

NSN, MFG P/N

5962011504631

NSN

5962-01-150-4631

MFG

RAYTHEON COMPANY DBA RAYTHEON

Description

BODY HEIGHT: 0.185 INCHES MAXIMUM
BODY LENGTH: 0.840 INCHES MAXIMUM
BODY WIDTH: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM
DESIGN FUNCTION AND QUANTITY: 1 POWER SUPPLY
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND W/OPEN COLLECTOR AND W/RESISTOR
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 4 INPUT
MAXIMUM POWER DISSIPATION RATING: 1.0 WATTS
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
SPECIAL FEATURES: AVAILABLE IN "J" PACKAGE-16 PIN CERAMIC DIP OR "L" PACKAGE-20 PIN CERAMIC LEADLESS CHIP CARRIER
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: TIN
TEST DATA DOCUMENT: 97953-1A7862 DRAWING

FR631-1003-102N

MICROCIRCUIT,LINEAR

NSN, MFG P/N

5962011504631

NSN

5962-01-150-4631

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FR631-1003-102N

MICROCIRCUIT,LINEAR

NSN, MFG P/N

5962011504631

NSN

5962-01-150-4631

MFG

BAE SYSTEMS INTEGRATED SYSTEM TECHNO LOGIES LTD

Description

BODY HEIGHT: 0.185 INCHES MAXIMUM
BODY LENGTH: 0.840 INCHES MAXIMUM
BODY WIDTH: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM
DESIGN FUNCTION AND QUANTITY: 1 POWER SUPPLY
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND W/OPEN COLLECTOR AND W/RESISTOR
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 4 INPUT
MAXIMUM POWER DISSIPATION RATING: 1.0 WATTS
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
SPECIAL FEATURES: AVAILABLE IN "J" PACKAGE-16 PIN CERAMIC DIP OR "L" PACKAGE-20 PIN CERAMIC LEADLESS CHIP CARRIER
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: TIN
TEST DATA DOCUMENT: 97953-1A7862 DRAWING

S161-00406

MICROCIRCUIT,LINEAR

NSN, MFG P/N

5962011504631

NSN

5962-01-150-4631

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S161-00406

MICROCIRCUIT,LINEAR

NSN, MFG P/N

5962011504631

NSN

5962-01-150-4631

MFG

NORTHROP GRUMMAN SYSTEMS CORPORATION DBA NORTHROP GRUMMAN SYSTEMS

Description

BODY HEIGHT: 0.185 INCHES MAXIMUM
BODY LENGTH: 0.840 INCHES MAXIMUM
BODY WIDTH: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM
DESIGN FUNCTION AND QUANTITY: 1 POWER SUPPLY
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND W/OPEN COLLECTOR AND W/RESISTOR
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 4 INPUT
MAXIMUM POWER DISSIPATION RATING: 1.0 WATTS
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
SPECIAL FEATURES: AVAILABLE IN "J" PACKAGE-16 PIN CERAMIC DIP OR "L" PACKAGE-20 PIN CERAMIC LEADLESS CHIP CARRIER
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: TIN
TEST DATA DOCUMENT: 97953-1A7862 DRAWING

SG1543J/10377

MICROCIRCUIT,LINEAR

NSN, MFG P/N

5962011504631

NSN

5962-01-150-4631

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SG1543J/10377

MICROCIRCUIT,LINEAR

NSN, MFG P/N

5962011504631

NSN

5962-01-150-4631

MFG

MICROSEMI CORP.-INTEGRATED PRODUCTS

Description

BODY HEIGHT: 0.185 INCHES MAXIMUM
BODY LENGTH: 0.840 INCHES MAXIMUM
BODY WIDTH: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM
DESIGN FUNCTION AND QUANTITY: 1 POWER SUPPLY
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND W/OPEN COLLECTOR AND W/RESISTOR
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 4 INPUT
MAXIMUM POWER DISSIPATION RATING: 1.0 WATTS
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
SPECIAL FEATURES: AVAILABLE IN "J" PACKAGE-16 PIN CERAMIC DIP OR "L" PACKAGE-20 PIN CERAMIC LEADLESS CHIP CARRIER
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: TIN
TEST DATA DOCUMENT: 97953-1A7862 DRAWING

SG1543J/883B

MICROCIRCUIT,LINEAR

NSN, MFG P/N

5962011504631

NSN

5962-01-150-4631

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SG1543J/883B

MICROCIRCUIT,LINEAR

NSN, MFG P/N

5962011504631

NSN

5962-01-150-4631

MFG

MICROSEMI CORP.-INTEGRATED PRODUCTS

Description

BODY HEIGHT: 0.185 INCHES MAXIMUM
BODY LENGTH: 0.840 INCHES MAXIMUM
BODY WIDTH: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM
DESIGN FUNCTION AND QUANTITY: 1 POWER SUPPLY
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND W/OPEN COLLECTOR AND W/RESISTOR
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 4 INPUT
MAXIMUM POWER DISSIPATION RATING: 1.0 WATTS
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
SPECIAL FEATURES: AVAILABLE IN "J" PACKAGE-16 PIN CERAMIC DIP OR "L" PACKAGE-20 PIN CERAMIC LEADLESS CHIP CARRIER
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: TIN
TEST DATA DOCUMENT: 97953-1A7862 DRAWING

SG1543J/883C

MICROCIRCUIT,LINEAR

NSN, MFG P/N

5962011504631

NSN

5962-01-150-4631

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SG1543J/883C

MICROCIRCUIT,LINEAR

NSN, MFG P/N

5962011504631

NSN

5962-01-150-4631

MFG

MICROSEMI CORP.-INTEGRATED PRODUCTS

Description

BODY HEIGHT: 0.185 INCHES MAXIMUM
BODY LENGTH: 0.840 INCHES MAXIMUM
BODY WIDTH: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM
DESIGN FUNCTION AND QUANTITY: 1 POWER SUPPLY
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND W/OPEN COLLECTOR AND W/RESISTOR
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 4 INPUT
MAXIMUM POWER DISSIPATION RATING: 1.0 WATTS
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
SPECIAL FEATURES: AVAILABLE IN "J" PACKAGE-16 PIN CERAMIC DIP OR "L" PACKAGE-20 PIN CERAMIC LEADLESS CHIP CARRIER
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: TIN
TEST DATA DOCUMENT: 97953-1A7862 DRAWING

SG2543J

MICROCIRCUIT,LINEAR

NSN, MFG P/N

5962011504631

NSN

5962-01-150-4631

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SG2543J

MICROCIRCUIT,LINEAR

NSN, MFG P/N

5962011504631

NSN

5962-01-150-4631

MFG

MICROSEMI CORP.-INTEGRATED PRODUCTS

Description

BODY HEIGHT: 0.185 INCHES MAXIMUM
BODY LENGTH: 0.840 INCHES MAXIMUM
BODY WIDTH: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM
DESIGN FUNCTION AND QUANTITY: 1 POWER SUPPLY
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND W/OPEN COLLECTOR AND W/RESISTOR
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 4 INPUT
MAXIMUM POWER DISSIPATION RATING: 1.0 WATTS
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
SPECIAL FEATURES: AVAILABLE IN "J" PACKAGE-16 PIN CERAMIC DIP OR "L" PACKAGE-20 PIN CERAMIC LEADLESS CHIP CARRIER
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: TIN
TEST DATA DOCUMENT: 97953-1A7862 DRAWING

1818-0698

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962011504655

NSN

5962-01-150-4655

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1818-0698

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962011504655

NSN

5962-01-150-4655

MFG

AGILENT TECHNOLOGIES INC. DBA NORTH AMERICAN CONTACT CENTER DIV AGILENT BUSINESS CENTER

Description

(NON-CORE DATA) BIT QUANTITY: 16384
(NON-CORE DATA) WORD QUANTITY: 2048
BODY HEIGHT: 0.140 INCHES MINIMUM AND 0.180 INCHES MAXIMUM
BODY LENGTH: 1.290 INCHES MAXIMUM
BODY WIDTH: 0.590 INCHES MINIMUM AND 0.625 INCHES MAXIMUM
FEATURES PROVIDED: STATIC OPERATION AND ASYNCHRONOUS AND 3-STATE OUTPUT AND HIGH PERFORMANCE AND W/BUFFERED OUTPUT
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 14 INPUT
MAXIMUM POWER DISSIPATION RATING: 1.0 WATTS
MEMORY DEVICE TYPE: ROM
OPERATING TEMP RANGE: -0.0 TO 70.0 DEG CELSIUS
OUTPUT LOGIC FORM: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 24 PRINTED CIRCUIT
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 7.0 VOLTS MAXIMUM POWER SOURCE

SYD2316A

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962011504655

NSN

5962-01-150-4655

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SYD2316A

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962011504655

NSN

5962-01-150-4655

MFG

SYNERTEK

Description

(NON-CORE DATA) BIT QUANTITY: 16384
(NON-CORE DATA) WORD QUANTITY: 2048
BODY HEIGHT: 0.140 INCHES MINIMUM AND 0.180 INCHES MAXIMUM
BODY LENGTH: 1.290 INCHES MAXIMUM
BODY WIDTH: 0.590 INCHES MINIMUM AND 0.625 INCHES MAXIMUM
FEATURES PROVIDED: STATIC OPERATION AND ASYNCHRONOUS AND 3-STATE OUTPUT AND HIGH PERFORMANCE AND W/BUFFERED OUTPUT
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 14 INPUT
MAXIMUM POWER DISSIPATION RATING: 1.0 WATTS
MEMORY DEVICE TYPE: ROM
OPERATING TEMP RANGE: -0.0 TO 70.0 DEG CELSIUS
OUTPUT LOGIC FORM: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 24 PRINTED CIRCUIT
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 7.0 VOLTS MAXIMUM POWER SOURCE

74F240DC

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962011504682

NSN

5962-01-150-4682

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74F240DC

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962011504682

NSN

5962-01-150-4682

MFG

FAIRCHILD SEMICONDUCTOR CORP

Description

BODY HEIGHT: 0.199 INCHES MAXIMUM
BODY LENGTH: 0.960 INCHES MINIMUM AND 0.975 INCHES MAXIMUM
BODY WIDTH: 0.280 INCHES MINIMUM AND 0.288 INCHES MAXIMUM
DESIGN FUNCTION AND QUANTITY: 8 BUFFER
FEATURES PROVIDED: HERMETICALLY SEALED AND 3-STATE OUTPUT AND W/ENABLE AND POSITIVE OUTPUTS
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 10 INPUT
OPERATING TEMP RANGE: -0.0 TO 70.0 DEG CELSIUS
OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 20 PRINTED CIRCUIT
TIME RATING PER CHACTERISTIC: 18.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 18.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 5.5 VOLTS MAXIMUM POWER SOURCE

277-4005-138-01

MICROCIRCUIT ASSEMBLY

NSN, MFG P/N

5962011505622

NSN

5962-01-150-5622

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277-4005-138-01

MICROCIRCUIT ASSEMBLY

NSN, MFG P/N

5962011505622

NSN

5962-01-150-5622

MFG

GE AVIATION SYSTEMS LLC DBA GE AVIATION DIV INFORMATION SYSTEMS - GERMANTOWN

Description

SPECIAL FEATURES: 2.520 IN.LG;0.550 IN.W;0.170 IN.H;6 TYPE 4031;ELECTROSTATIC DEVICES;