My Quote Request
No products added yet
5962-00-861-3220
20 Products
U5B770931
MICROCIRCUIT,LINEAR
NSN, MFG P/N
5962008613220
NSN
5962-00-861-3220
MFG
FAIRCHILD SEMICONDUCTOR CORP
Description
BODY HEIGHT: 0.165 INCHES MINIMUM AND 0.185 INCHES MAXIMUM
BODY OUTSIDE DIAMETER: 0.335 INCHES MINIMUM AND 0.370 INCHES MAXIMUM
CASE OUTLINE SOURCE AND DESIGNATOR: T0-99 JOINT ELECTRON DEVICE ENGINEERING COUNCIL
FEATURES PROVIDED: MONOLITHIC AND HERMETICALLY SEALED AND NEGATIVE OUTPUTS AND POSITIVE OUTPUTS AND EXTERNALLY COMPENSATED AND HIGH GAIN
III PRECIOUS MATERIAL: GOLD
III PRECIOUS MATERIAL AND LOCATION: TERMINALS GOLD
INCLOSURE CONFIGURATION: CAN
INCLOSURE MATERIAL: GLASS AND METAL
INPUT CIRCUIT PATTERN: 4 INPUT
MANUFACTURERS CODE: 96214
MAXIMUM POWER DISSIPATION RATING: 300.0 MILLIWATTS
MFR SOURCE CONTROLLING REFERENCE: 507856-1
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
SPEC/STD CONTROLLING DATA:
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: GOLD
TEST DATA DOCUMENT: 96214-507856 DRAWING
TIME RATING PER CHACTERISTIC: 1000.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 1000.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT
Related Searches:
LM709
MICROCIRCUIT,LINEAR
NSN, MFG P/N
5962008613220
NSN
5962-00-861-3220
MFG
NATIONAL SEMICONDUCTOR CORPORATION
Description
BODY HEIGHT: 0.165 INCHES MINIMUM AND 0.185 INCHES MAXIMUM
BODY OUTSIDE DIAMETER: 0.335 INCHES MINIMUM AND 0.370 INCHES MAXIMUM
CASE OUTLINE SOURCE AND DESIGNATOR: T0-99 JOINT ELECTRON DEVICE ENGINEERING COUNCIL
FEATURES PROVIDED: MONOLITHIC AND HERMETICALLY SEALED AND NEGATIVE OUTPUTS AND POSITIVE OUTPUTS AND EXTERNALLY COMPENSATED AND HIGH GAIN
III PRECIOUS MATERIAL: GOLD
III PRECIOUS MATERIAL AND LOCATION: TERMINALS GOLD
INCLOSURE CONFIGURATION: CAN
INCLOSURE MATERIAL: GLASS AND METAL
INPUT CIRCUIT PATTERN: 4 INPUT
MANUFACTURERS CODE: 96214
MAXIMUM POWER DISSIPATION RATING: 300.0 MILLIWATTS
MFR SOURCE CONTROLLING REFERENCE: 507856-1
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
SPEC/STD CONTROLLING DATA:
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: GOLD
TEST DATA DOCUMENT: 96214-507856 DRAWING
TIME RATING PER CHACTERISTIC: 1000.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 1000.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT
Related Searches:
SL6820
MICROCIRCUIT,LINEAR
NSN, MFG P/N
5962008613220
NSN
5962-00-861-3220
MFG
NATIONAL SEMICONDUCTOR CORPORATION
Description
BODY HEIGHT: 0.165 INCHES MINIMUM AND 0.185 INCHES MAXIMUM
BODY OUTSIDE DIAMETER: 0.335 INCHES MINIMUM AND 0.370 INCHES MAXIMUM
CASE OUTLINE SOURCE AND DESIGNATOR: T0-99 JOINT ELECTRON DEVICE ENGINEERING COUNCIL
FEATURES PROVIDED: MONOLITHIC AND HERMETICALLY SEALED AND NEGATIVE OUTPUTS AND POSITIVE OUTPUTS AND EXTERNALLY COMPENSATED AND HIGH GAIN
III PRECIOUS MATERIAL: GOLD
III PRECIOUS MATERIAL AND LOCATION: TERMINALS GOLD
INCLOSURE CONFIGURATION: CAN
INCLOSURE MATERIAL: GLASS AND METAL
INPUT CIRCUIT PATTERN: 4 INPUT
MANUFACTURERS CODE: 96214
MAXIMUM POWER DISSIPATION RATING: 300.0 MILLIWATTS
MFR SOURCE CONTROLLING REFERENCE: 507856-1
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
SPEC/STD CONTROLLING DATA:
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: GOLD
TEST DATA DOCUMENT: 96214-507856 DRAWING
TIME RATING PER CHACTERISTIC: 1000.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 1000.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT
Related Searches:
SN5074
MICROCIRCUIT,LINEAR
NSN, MFG P/N
5962008613220
NSN
5962-00-861-3220
MFG
TEXAS INSTRUMENTS INCORPORATED DBA TEXAS INSTRUMENTS DIV SEMICONDUCTOR GROUP
Description
BODY HEIGHT: 0.165 INCHES MINIMUM AND 0.185 INCHES MAXIMUM
BODY OUTSIDE DIAMETER: 0.335 INCHES MINIMUM AND 0.370 INCHES MAXIMUM
CASE OUTLINE SOURCE AND DESIGNATOR: T0-99 JOINT ELECTRON DEVICE ENGINEERING COUNCIL
FEATURES PROVIDED: MONOLITHIC AND HERMETICALLY SEALED AND NEGATIVE OUTPUTS AND POSITIVE OUTPUTS AND EXTERNALLY COMPENSATED AND HIGH GAIN
III PRECIOUS MATERIAL: GOLD
III PRECIOUS MATERIAL AND LOCATION: TERMINALS GOLD
INCLOSURE CONFIGURATION: CAN
INCLOSURE MATERIAL: GLASS AND METAL
INPUT CIRCUIT PATTERN: 4 INPUT
MANUFACTURERS CODE: 96214
MAXIMUM POWER DISSIPATION RATING: 300.0 MILLIWATTS
MFR SOURCE CONTROLLING REFERENCE: 507856-1
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
SPEC/STD CONTROLLING DATA:
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: GOLD
TEST DATA DOCUMENT: 96214-507856 DRAWING
TIME RATING PER CHACTERISTIC: 1000.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 1000.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT
Related Searches:
SN52709L
MICROCIRCUIT,LINEAR
NSN, MFG P/N
5962008613220
NSN
5962-00-861-3220
MFG
TEXAS INSTRUMENTS INCORPORATED DBA TEXAS INSTRUMENTS DIV SEMICONDUCTOR GROUP
Description
BODY HEIGHT: 0.165 INCHES MINIMUM AND 0.185 INCHES MAXIMUM
BODY OUTSIDE DIAMETER: 0.335 INCHES MINIMUM AND 0.370 INCHES MAXIMUM
CASE OUTLINE SOURCE AND DESIGNATOR: T0-99 JOINT ELECTRON DEVICE ENGINEERING COUNCIL
FEATURES PROVIDED: MONOLITHIC AND HERMETICALLY SEALED AND NEGATIVE OUTPUTS AND POSITIVE OUTPUTS AND EXTERNALLY COMPENSATED AND HIGH GAIN
III PRECIOUS MATERIAL: GOLD
III PRECIOUS MATERIAL AND LOCATION: TERMINALS GOLD
INCLOSURE CONFIGURATION: CAN
INCLOSURE MATERIAL: GLASS AND METAL
INPUT CIRCUIT PATTERN: 4 INPUT
MANUFACTURERS CODE: 96214
MAXIMUM POWER DISSIPATION RATING: 300.0 MILLIWATTS
MFR SOURCE CONTROLLING REFERENCE: 507856-1
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
SPEC/STD CONTROLLING DATA:
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: GOLD
TEST DATA DOCUMENT: 96214-507856 DRAWING
TIME RATING PER CHACTERISTIC: 1000.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 1000.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT
Related Searches:
195314-001
MICROCIRCUIT,LINEAR
NSN, MFG P/N
5962008613489
NSN
5962-00-861-3489
MFG
BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION I
Description
BODY HEIGHT: 0.185 INCHES NOMINAL
BODY OUTSIDE DIAMETER: 0.370 INCHES NOMINAL
FEATURES PROVIDED: HERMETICALLY SEALED
INCLOSURE MATERIAL: METAL
MANUFACTURERS CODE: 81413
MFR SOURCE CONTROLLING REFERENCE: 195314-001
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
SPEC/STD CONTROLLING DATA:
Related Searches:
PA71031
MICROCIRCUIT,LINEAR
NSN, MFG P/N
5962008613489
NSN
5962-00-861-3489
MFG
FORD AEROSPACE CORP ELECTRONICS DIV
Description
BODY HEIGHT: 0.185 INCHES NOMINAL
BODY OUTSIDE DIAMETER: 0.370 INCHES NOMINAL
FEATURES PROVIDED: HERMETICALLY SEALED
INCLOSURE MATERIAL: METAL
MANUFACTURERS CODE: 81413
MFR SOURCE CONTROLLING REFERENCE: 195314-001
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
SPEC/STD CONTROLLING DATA:
Related Searches:
U5B771031
MICROCIRCUIT,LINEAR
NSN, MFG P/N
5962008613489
NSN
5962-00-861-3489
MFG
FAIRCHILD SEMICONDUCTOR CORP
Description
BODY HEIGHT: 0.185 INCHES NOMINAL
BODY OUTSIDE DIAMETER: 0.370 INCHES NOMINAL
FEATURES PROVIDED: HERMETICALLY SEALED
INCLOSURE MATERIAL: METAL
MANUFACTURERS CODE: 81413
MFR SOURCE CONTROLLING REFERENCE: 195314-001
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
SPEC/STD CONTROLLING DATA:
Related Searches:
195302-000
MICROCIRCUIT,DIGITAL
NSN, MFG P/N
5962008613494
NSN
5962-00-861-3494
MFG
BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION I
Description
BODY HEIGHT: 0.065 INCHES NOMINAL
BODY LENGTH: 0.340 INCHES NOMINAL
BODY WIDTH: 0.250 INCHES NOMINAL
FEATURES PROVIDED: HERMETICALLY SEALED
INCLOSURE CONFIGURATION: FLAT PACK
MANUFACTURERS CODE: 81413
MFR SOURCE CONTROLLING REFERENCE: 195302-000
SPEC/STD CONTROLLING DATA:
Related Searches:
264Q2
MICROCIRCUIT,DIGITAL
NSN, MFG P/N
5962008613494
NSN
5962-00-861-3494
MFG
PHILCO-FORD CORP MICROELECTRONICS DIV
Description
BODY HEIGHT: 0.065 INCHES NOMINAL
BODY LENGTH: 0.340 INCHES NOMINAL
BODY WIDTH: 0.250 INCHES NOMINAL
FEATURES PROVIDED: HERMETICALLY SEALED
INCLOSURE CONFIGURATION: FLAT PACK
MANUFACTURERS CODE: 81413
MFR SOURCE CONTROLLING REFERENCE: 195302-000
SPEC/STD CONTROLLING DATA:
Related Searches:
C8159J
MICROCIRCUIT,DIGITAL
NSN, MFG P/N
5962008613494
NSN
5962-00-861-3494
MFG
PHILIPS SEMICONDUCTORS INC
Description
BODY HEIGHT: 0.065 INCHES NOMINAL
BODY LENGTH: 0.340 INCHES NOMINAL
BODY WIDTH: 0.250 INCHES NOMINAL
FEATURES PROVIDED: HERMETICALLY SEALED
INCLOSURE CONFIGURATION: FLAT PACK
MANUFACTURERS CODE: 81413
MFR SOURCE CONTROLLING REFERENCE: 195302-000
SPEC/STD CONTROLLING DATA:
Related Searches:
UBA2176
MICROCIRCUIT,DIGITAL
NSN, MFG P/N
5962008613494
NSN
5962-00-861-3494
MFG
SPRAGUE ELECTRIC CO WORLD HQS
Description
BODY HEIGHT: 0.065 INCHES NOMINAL
BODY LENGTH: 0.340 INCHES NOMINAL
BODY WIDTH: 0.250 INCHES NOMINAL
FEATURES PROVIDED: HERMETICALLY SEALED
INCLOSURE CONFIGURATION: FLAT PACK
MANUFACTURERS CODE: 81413
MFR SOURCE CONTROLLING REFERENCE: 195302-000
SPEC/STD CONTROLLING DATA:
Related Searches:
UBA2177
MICROCIRCUIT,DIGITAL
NSN, MFG P/N
5962008613494
NSN
5962-00-861-3494
MFG
SPRAGUE ELECTRIC CO WORLD HQS
Description
BODY HEIGHT: 0.065 INCHES NOMINAL
BODY LENGTH: 0.340 INCHES NOMINAL
BODY WIDTH: 0.250 INCHES NOMINAL
FEATURES PROVIDED: HERMETICALLY SEALED
INCLOSURE CONFIGURATION: FLAT PACK
MANUFACTURERS CODE: 81413
MFR SOURCE CONTROLLING REFERENCE: 195302-000
SPEC/STD CONTROLLING DATA:
Related Searches:
195309-000
MICROCIRCUIT,DIGITAL
NSN, MFG P/N
5962008613504
NSN
5962-00-861-3504
MFG
BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION I
Description
BODY HEIGHT: 0.065 INCHES NOMINAL
BODY LENGTH: 0.350 INCHES NOMINAL
BODY WIDTH: 0.260 INCHES NOMINAL
FEATURES PROVIDED: HERMETICALLY SEALED
INCLOSURE MATERIAL: CERAMIC
MANUFACTURERS CODE: 81413
MFR SOURCE CONTROLLING REFERENCE: 195309-000
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
SPEC/STD CONTROLLING DATA:
Related Searches:
C8166J
MICROCIRCUIT,DIGITAL
NSN, MFG P/N
5962008613504
NSN
5962-00-861-3504
MFG
PHILIPS SEMICONDUCTORS INC
Description
BODY HEIGHT: 0.065 INCHES NOMINAL
BODY LENGTH: 0.350 INCHES NOMINAL
BODY WIDTH: 0.260 INCHES NOMINAL
FEATURES PROVIDED: HERMETICALLY SEALED
INCLOSURE MATERIAL: CERAMIC
MANUFACTURERS CODE: 81413
MFR SOURCE CONTROLLING REFERENCE: 195309-000
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
SPEC/STD CONTROLLING DATA:
Related Searches:
UBA2176
MICROCIRCUIT,DIGITAL
NSN, MFG P/N
5962008613504
NSN
5962-00-861-3504
MFG
SPRAGUE ELECTRIC CO WORLD HQS
Description
BODY HEIGHT: 0.065 INCHES NOMINAL
BODY LENGTH: 0.350 INCHES NOMINAL
BODY WIDTH: 0.260 INCHES NOMINAL
FEATURES PROVIDED: HERMETICALLY SEALED
INCLOSURE MATERIAL: CERAMIC
MANUFACTURERS CODE: 81413
MFR SOURCE CONTROLLING REFERENCE: 195309-000
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
SPEC/STD CONTROLLING DATA:
Related Searches:
USA2176
MICROCIRCUIT,DIGITAL
NSN, MFG P/N
5962008613504
NSN
5962-00-861-3504
MFG
SPRAGUE ELECTRIC CO WORLD HQS
Description
BODY HEIGHT: 0.065 INCHES NOMINAL
BODY LENGTH: 0.350 INCHES NOMINAL
BODY WIDTH: 0.260 INCHES NOMINAL
FEATURES PROVIDED: HERMETICALLY SEALED
INCLOSURE MATERIAL: CERAMIC
MANUFACTURERS CODE: 81413
MFR SOURCE CONTROLLING REFERENCE: 195309-000
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
SPEC/STD CONTROLLING DATA:
Related Searches:
195308-000
MICROCIRCUIT,LINEAR
NSN, MFG P/N
5962008613507
NSN
5962-00-861-3507
MFG
BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION I
Description
BODY HEIGHT: 0.065 INCHES MAXIMUM
BODY LENGTH: 0.330 INCHES MINIMUM AND 0.350 INCHES MAXIMUM
BODY WIDTH: 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM
CURRENT RATING PER CHARACTERISTIC: 30.00 MILLIAMPERES MAXIMUM INPUT
DESIGN FUNCTION AND QUANTITY: 2 DRIVER, LINE
FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC AND W/RESISTOR
III OVERALL WIDTH: 0.500 INCHES NOMINAL
III PRECIOUS MATERIAL: GOLD
III PRECIOUS MATERIAL AND LOCATION: TERMINAL SURFACES GOLD
INCLOSURE CONFIGURATION: FLAT PACK
INCLOSURE MATERIAL: CERAMIC OR METAL
INPUT CIRCUIT PATTERN: DUAL 4 INPUT
MAXIMUM POWER DISSIPATION RATING: 250.0 MILLIWATTS
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: GOLD
TERMINAL TYPE AND QUANTITY: 14 FLAT LEADS
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 8.2 VOLTS NOMINAL POWER SOURCE
Related Searches:
264E4
MICROCIRCUIT,LINEAR
NSN, MFG P/N
5962008613507
NSN
5962-00-861-3507
MFG
PHILCO-FORD CORP MICROELECTRONICS DIV
Description
BODY HEIGHT: 0.065 INCHES MAXIMUM
BODY LENGTH: 0.330 INCHES MINIMUM AND 0.350 INCHES MAXIMUM
BODY WIDTH: 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM
CURRENT RATING PER CHARACTERISTIC: 30.00 MILLIAMPERES MAXIMUM INPUT
DESIGN FUNCTION AND QUANTITY: 2 DRIVER, LINE
FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC AND W/RESISTOR
III OVERALL WIDTH: 0.500 INCHES NOMINAL
III PRECIOUS MATERIAL: GOLD
III PRECIOUS MATERIAL AND LOCATION: TERMINAL SURFACES GOLD
INCLOSURE CONFIGURATION: FLAT PACK
INCLOSURE MATERIAL: CERAMIC OR METAL
INPUT CIRCUIT PATTERN: DUAL 4 INPUT
MAXIMUM POWER DISSIPATION RATING: 250.0 MILLIWATTS
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: GOLD
TERMINAL TYPE AND QUANTITY: 14 FLAT LEADS
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 8.2 VOLTS NOMINAL POWER SOURCE
Related Searches:
C8165J
MICROCIRCUIT,LINEAR
NSN, MFG P/N
5962008613507
NSN
5962-00-861-3507
MFG
PHILIPS SEMICONDUCTORS INC
Description
BODY HEIGHT: 0.065 INCHES MAXIMUM
BODY LENGTH: 0.330 INCHES MINIMUM AND 0.350 INCHES MAXIMUM
BODY WIDTH: 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM
CURRENT RATING PER CHARACTERISTIC: 30.00 MILLIAMPERES MAXIMUM INPUT
DESIGN FUNCTION AND QUANTITY: 2 DRIVER, LINE
FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC AND W/RESISTOR
III OVERALL WIDTH: 0.500 INCHES NOMINAL
III PRECIOUS MATERIAL: GOLD
III PRECIOUS MATERIAL AND LOCATION: TERMINAL SURFACES GOLD
INCLOSURE CONFIGURATION: FLAT PACK
INCLOSURE MATERIAL: CERAMIC OR METAL
INPUT CIRCUIT PATTERN: DUAL 4 INPUT
MAXIMUM POWER DISSIPATION RATING: 250.0 MILLIWATTS
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: GOLD
TERMINAL TYPE AND QUANTITY: 14 FLAT LEADS
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 8.2 VOLTS NOMINAL POWER SOURCE
