Fisher X-Ray XDAL 237- measures functional coatings in the electronics and semiconductor industries. Thermo Fisher Scientific XL3T700 – measures metallurgical composition for RoHS compliance and lead finish/plating verification.
TruView Prime powered by the TruView 10 Premium Source 130 provides real-time imaging for non-destructive inspection of electronic component comparative analysis against verified component images.
Decapsulation & Die Verification
Nisene Jet Etch II – employs a destructive process for plastic packages which exposes the component die for full microscopic, visual inspection.
Thermo Electron S10 Spectrometer – provides comparative analysis using light spectroscopy to ensure plastic package material composition homogeneity.
3532-50 LCR Hitester measures inductance, capacitance, and resistance for tolerance verification at ambient temperature.
Ascentech Gen 3 Must System III – measures “wetting” to determine the ability of the termination to form a uniform, smooth film of solder to ensure excellent adhesion properties.
OKOS Vue400 – utilizes high frequency ultrasound to provide a non-destructive microscopic evaluation of a solid’s interior physical properties, including defects such as cracks, delaminations and voids.
RH-2000 Microscope provides high resolution microscopic imaging for die inspection using high-res digital cameras up to 5000x magnification.
Thermal Product Solutions Lab Oven – provides capability to bake and dry pack components that require moisture sensitive packing requirements.
Starrett optical comparator provides measurements that are projected on a screen at a precisely-known magnification.
Xeltek Superpro 5000 – provides capability to verify that programmable devices have not been pre-programmed.
ABI Sentry Counterfeit IC Detector – detects the unique electrical signature (PinPrint) of the leads on a dip package device for use in comparative analysis with a verified known good device.