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5962-01-414-2649

20 Products

ROM/PROM FAMILY 230

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962014142649

NSN

5962-01-414-2649

View More Info

ROM/PROM FAMILY 230

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962014142649

NSN

5962-01-414-2649

MFG

DLA LAND AND MARITIME

Description

INCLOSURE CONFIGURATION: LEADLESS FLAT PACK
INCLOSURE MATERIAL: CERAMIC
MEMORY DEVICE TYPE: PAL
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
PART NAME ASSIGNED BY CONTROLLING AGENCY: PROGRAMMED PAL
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 28 LEADLESS
TIME RATING PER CHACTERISTIC: 80.00 NANOSECONDS MAXIMUM ACCESS
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 5.5 VOLTS NOMINAL POWER SOURCE

7548350G0128

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962014142649

NSN

5962-01-414-2649

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7548350G0128

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962014142649

NSN

5962-01-414-2649

MFG

LOCKHEED MARTIN CORP NAVAL ELECTRONICS & SURVEILLANCE SYSTEMS

Description

INCLOSURE CONFIGURATION: LEADLESS FLAT PACK
INCLOSURE MATERIAL: CERAMIC
MEMORY DEVICE TYPE: PAL
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
PART NAME ASSIGNED BY CONTROLLING AGENCY: PROGRAMMED PAL
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 28 LEADLESS
TIME RATING PER CHACTERISTIC: 80.00 NANOSECONDS MAXIMUM ACCESS
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 5.5 VOLTS NOMINAL POWER SOURCE

7548350G128

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962014142649

NSN

5962-01-414-2649

View More Info

7548350G128

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962014142649

NSN

5962-01-414-2649

MFG

LOCKHEED MARTIN CORP NAVAL ELECTRONICS & SURVEILLANCE SYSTEMS

Description

INCLOSURE CONFIGURATION: LEADLESS FLAT PACK
INCLOSURE MATERIAL: CERAMIC
MEMORY DEVICE TYPE: PAL
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
PART NAME ASSIGNED BY CONTROLLING AGENCY: PROGRAMMED PAL
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 28 LEADLESS
TIME RATING PER CHACTERISTIC: 80.00 NANOSECONDS MAXIMUM ACCESS
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 5.5 VOLTS NOMINAL POWER SOURCE

82S100/B3A

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962014142649

NSN

5962-01-414-2649

View More Info

82S100/B3A

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962014142649

NSN

5962-01-414-2649

MFG

PHILIPS SEMICONDUCTORS INC

Description

INCLOSURE CONFIGURATION: LEADLESS FLAT PACK
INCLOSURE MATERIAL: CERAMIC
MEMORY DEVICE TYPE: PAL
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
PART NAME ASSIGNED BY CONTROLLING AGENCY: PROGRAMMED PAL
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 28 LEADLESS
TIME RATING PER CHACTERISTIC: 80.00 NANOSECONDS MAXIMUM ACCESS
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 5.5 VOLTS NOMINAL POWER SOURCE

7542105P501

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962014142650

NSN

5962-01-414-2650

View More Info

7542105P501

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962014142650

NSN

5962-01-414-2650

MFG

LOCKHEED MARTIN CORP NAVAL ELECTRONICS & SURVEILLANCE SYSTEMS

Description

INCLOSURE CONFIGURATION: LEADLESS FLAT PACK
INCLOSURE MATERIAL: CERAMIC
MEMORY DEVICE TYPE: PAL
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
PART NAME ASSIGNED BY CONTROLLING AGENCY: PROGRAMMED PAL
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 28 LEADLESS
TIME RATING PER CHACTERISTIC: 80.00 NANOSECONDS MAXIMUM ACCESS
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 5.5 VOLTS NOMINAL POWER SOURCE

7548350G0215

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962014142650

NSN

5962-01-414-2650

View More Info

7548350G0215

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962014142650

NSN

5962-01-414-2650

MFG

LOCKHEED MARTIN CORP NAVAL ELECTRONICS & SURVEILLANCE SYSTEMS

Description

INCLOSURE CONFIGURATION: LEADLESS FLAT PACK
INCLOSURE MATERIAL: CERAMIC
MEMORY DEVICE TYPE: PAL
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
PART NAME ASSIGNED BY CONTROLLING AGENCY: PROGRAMMED PAL
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 28 LEADLESS
TIME RATING PER CHACTERISTIC: 80.00 NANOSECONDS MAXIMUM ACCESS
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 5.5 VOLTS NOMINAL POWER SOURCE

7548350G215

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962014142650

NSN

5962-01-414-2650

View More Info

7548350G215

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962014142650

NSN

5962-01-414-2650

MFG

LOCKHEED MARTIN CORP NAVAL ELECTRONICS & SURVEILLANCE SYSTEMS

Description

INCLOSURE CONFIGURATION: LEADLESS FLAT PACK
INCLOSURE MATERIAL: CERAMIC
MEMORY DEVICE TYPE: PAL
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
PART NAME ASSIGNED BY CONTROLLING AGENCY: PROGRAMMED PAL
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 28 LEADLESS
TIME RATING PER CHACTERISTIC: 80.00 NANOSECONDS MAXIMUM ACCESS
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 5.5 VOLTS NOMINAL POWER SOURCE

82S100/B3A

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962014142650

NSN

5962-01-414-2650

View More Info

82S100/B3A

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962014142650

NSN

5962-01-414-2650

MFG

PHILIPS SEMICONDUCTORS INC

Description

INCLOSURE CONFIGURATION: LEADLESS FLAT PACK
INCLOSURE MATERIAL: CERAMIC
MEMORY DEVICE TYPE: PAL
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
PART NAME ASSIGNED BY CONTROLLING AGENCY: PROGRAMMED PAL
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 28 LEADLESS
TIME RATING PER CHACTERISTIC: 80.00 NANOSECONDS MAXIMUM ACCESS
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 5.5 VOLTS NOMINAL POWER SOURCE

ROM/PROM FAMILY 230

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962014142650

NSN

5962-01-414-2650

View More Info

ROM/PROM FAMILY 230

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962014142650

NSN

5962-01-414-2650

MFG

DLA LAND AND MARITIME

Description

INCLOSURE CONFIGURATION: LEADLESS FLAT PACK
INCLOSURE MATERIAL: CERAMIC
MEMORY DEVICE TYPE: PAL
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
PART NAME ASSIGNED BY CONTROLLING AGENCY: PROGRAMMED PAL
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 28 LEADLESS
TIME RATING PER CHACTERISTIC: 80.00 NANOSECONDS MAXIMUM ACCESS
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 5.5 VOLTS NOMINAL POWER SOURCE

7542105P501

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962014142651

NSN

5962-01-414-2651

View More Info

7542105P501

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962014142651

NSN

5962-01-414-2651

MFG

LOCKHEED MARTIN CORP NAVAL ELECTRONICS & SURVEILLANCE SYSTEMS

Description

INCLOSURE CONFIGURATION: LEADLESS FLAT PACK
INCLOSURE MATERIAL: CERAMIC
MEMORY DEVICE TYPE: PAL
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
PART NAME ASSIGNED BY CONTROLLING AGENCY: PROGRAMMED PAL
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 28 LEADLESS
TIME RATING PER CHACTERISTIC: 80.00 NANOSECONDS MAXIMUM ACCESS
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 5.5 VOLTS NOMINAL POWER SOURCE

7548350G0131

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962014142651

NSN

5962-01-414-2651

View More Info

7548350G0131

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962014142651

NSN

5962-01-414-2651

MFG

LOCKHEED MARTIN CORP NAVAL ELECTRONICS & SURVEILLANCE SYSTEMS

Description

INCLOSURE CONFIGURATION: LEADLESS FLAT PACK
INCLOSURE MATERIAL: CERAMIC
MEMORY DEVICE TYPE: PAL
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
PART NAME ASSIGNED BY CONTROLLING AGENCY: PROGRAMMED PAL
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 28 LEADLESS
TIME RATING PER CHACTERISTIC: 80.00 NANOSECONDS MAXIMUM ACCESS
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 5.5 VOLTS NOMINAL POWER SOURCE

7548350G131

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962014142651

NSN

5962-01-414-2651

View More Info

7548350G131

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962014142651

NSN

5962-01-414-2651

MFG

LOCKHEED MARTIN CORP NAVAL ELECTRONICS & SURVEILLANCE SYSTEMS

Description

INCLOSURE CONFIGURATION: LEADLESS FLAT PACK
INCLOSURE MATERIAL: CERAMIC
MEMORY DEVICE TYPE: PAL
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
PART NAME ASSIGNED BY CONTROLLING AGENCY: PROGRAMMED PAL
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 28 LEADLESS
TIME RATING PER CHACTERISTIC: 80.00 NANOSECONDS MAXIMUM ACCESS
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 5.5 VOLTS NOMINAL POWER SOURCE

82S100/B3A

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962014142651

NSN

5962-01-414-2651

View More Info

82S100/B3A

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962014142651

NSN

5962-01-414-2651

MFG

PHILIPS SEMICONDUCTORS INC

Description

INCLOSURE CONFIGURATION: LEADLESS FLAT PACK
INCLOSURE MATERIAL: CERAMIC
MEMORY DEVICE TYPE: PAL
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
PART NAME ASSIGNED BY CONTROLLING AGENCY: PROGRAMMED PAL
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 28 LEADLESS
TIME RATING PER CHACTERISTIC: 80.00 NANOSECONDS MAXIMUM ACCESS
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 5.5 VOLTS NOMINAL POWER SOURCE

ROM/PROM FAMILY 230

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962014142651

NSN

5962-01-414-2651

View More Info

ROM/PROM FAMILY 230

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962014142651

NSN

5962-01-414-2651

MFG

DLA LAND AND MARITIME

Description

INCLOSURE CONFIGURATION: LEADLESS FLAT PACK
INCLOSURE MATERIAL: CERAMIC
MEMORY DEVICE TYPE: PAL
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
PART NAME ASSIGNED BY CONTROLLING AGENCY: PROGRAMMED PAL
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 28 LEADLESS
TIME RATING PER CHACTERISTIC: 80.00 NANOSECONDS MAXIMUM ACCESS
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 5.5 VOLTS NOMINAL POWER SOURCE

7542105P501

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962014142652

NSN

5962-01-414-2652

View More Info

7542105P501

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962014142652

NSN

5962-01-414-2652

MFG

LOCKHEED MARTIN CORP NAVAL ELECTRONICS & SURVEILLANCE SYSTEMS

Description

INCLOSURE CONFIGURATION: LEADLESS FLAT PACK
INCLOSURE MATERIAL: CERAMIC
MEMORY DEVICE TYPE: PAL
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
PART NAME ASSIGNED BY CONTROLLING AGENCY: PROGRAMMED PAL
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 28 LEADLESS
TIME RATING PER CHACTERISTIC: 80.00 NANOSECONDS MAXIMUM ACCESS
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 5.5 VOLTS NOMINAL POWER SOURCE

7548350G0127

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962014142652

NSN

5962-01-414-2652

View More Info

7548350G0127

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962014142652

NSN

5962-01-414-2652

MFG

LOCKHEED MARTIN CORP NAVAL ELECTRONICS & SURVEILLANCE SYSTEMS

Description

INCLOSURE CONFIGURATION: LEADLESS FLAT PACK
INCLOSURE MATERIAL: CERAMIC
MEMORY DEVICE TYPE: PAL
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
PART NAME ASSIGNED BY CONTROLLING AGENCY: PROGRAMMED PAL
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 28 LEADLESS
TIME RATING PER CHACTERISTIC: 80.00 NANOSECONDS MAXIMUM ACCESS
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 5.5 VOLTS NOMINAL POWER SOURCE

7548350G127

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962014142652

NSN

5962-01-414-2652

View More Info

7548350G127

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962014142652

NSN

5962-01-414-2652

MFG

LOCKHEED MARTIN CORP NAVAL ELECTRONICS & SURVEILLANCE SYSTEMS

Description

INCLOSURE CONFIGURATION: LEADLESS FLAT PACK
INCLOSURE MATERIAL: CERAMIC
MEMORY DEVICE TYPE: PAL
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
PART NAME ASSIGNED BY CONTROLLING AGENCY: PROGRAMMED PAL
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 28 LEADLESS
TIME RATING PER CHACTERISTIC: 80.00 NANOSECONDS MAXIMUM ACCESS
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 5.5 VOLTS NOMINAL POWER SOURCE

82S100/B3A

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962014142652

NSN

5962-01-414-2652

View More Info

82S100/B3A

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962014142652

NSN

5962-01-414-2652

MFG

PHILIPS SEMICONDUCTORS INC

Description

INCLOSURE CONFIGURATION: LEADLESS FLAT PACK
INCLOSURE MATERIAL: CERAMIC
MEMORY DEVICE TYPE: PAL
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
PART NAME ASSIGNED BY CONTROLLING AGENCY: PROGRAMMED PAL
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 28 LEADLESS
TIME RATING PER CHACTERISTIC: 80.00 NANOSECONDS MAXIMUM ACCESS
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 5.5 VOLTS NOMINAL POWER SOURCE

ROM/PROM FAMILY 230

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962014142652

NSN

5962-01-414-2652

View More Info

ROM/PROM FAMILY 230

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962014142652

NSN

5962-01-414-2652

MFG

DLA LAND AND MARITIME

Description

INCLOSURE CONFIGURATION: LEADLESS FLAT PACK
INCLOSURE MATERIAL: CERAMIC
MEMORY DEVICE TYPE: PAL
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
PART NAME ASSIGNED BY CONTROLLING AGENCY: PROGRAMMED PAL
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 28 LEADLESS
TIME RATING PER CHACTERISTIC: 80.00 NANOSECONDS MAXIMUM ACCESS
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 5.5 VOLTS NOMINAL POWER SOURCE

7542105P501

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962014142653

NSN

5962-01-414-2653

View More Info

7542105P501

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962014142653

NSN

5962-01-414-2653

MFG

LOCKHEED MARTIN CORP NAVAL ELECTRONICS & SURVEILLANCE SYSTEMS

Description

INCLOSURE CONFIGURATION: LEADLESS FLAT PACK
INCLOSURE MATERIAL: CERAMIC
MEMORY DEVICE TYPE: PAL
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
PART NAME ASSIGNED BY CONTROLLING AGENCY: PROGRAMMED PAL
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 28 LEADLESS
TIME RATING PER CHACTERISTIC: 80.00 NANOSECONDS MAXIMUM ACCESS
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 5.5 VOLTS NOMINAL POWER SOURCE