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5962-01-196-6097

20 Products

CP9831

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962011966097

NSN

5962-01-196-6097

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CP9831

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962011966097

NSN

5962-01-196-6097

MFG

MICRO-PRECISION TECHNOLOGIES INC.

Description

BODY HEIGHT: 0.100 INCHES MAXIMUM
DESIGN FUNCTION AND QUANTITY: 1 CONDITIONER, SIGNAL
III END ITEM IDENTIFICATION: C5B
INCLOSURE CONFIGURATION: FLAT PACK

4V14034-107A

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962011966097

NSN

5962-01-196-6097

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4V14034-107A

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962011966097

NSN

5962-01-196-6097

MFG

LOCKHEED MARTIN CORPORATION DBA LOCKHEED MARTIN

Description

BODY HEIGHT: 0.100 INCHES MAXIMUM
DESIGN FUNCTION AND QUANTITY: 1 CONDITIONER, SIGNAL
III END ITEM IDENTIFICATION: C5B
INCLOSURE CONFIGURATION: FLAT PACK

4V14293-103A

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962011966098

NSN

5962-01-196-6098

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4V14293-103A

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962011966098

NSN

5962-01-196-6098

MFG

LOCKHEED MARTIN CORPORATION DBA LOCKHEED MARTIN

Description

BODY HEIGHT: 0.100 INCHES MAXIMUM
DESIGN FUNCTION AND QUANTITY: 1 CONDITIONER, SIGNAL
III END ITEM IDENTIFICATION: C5B
INCLOSURE CONFIGURATION: FLAT PACK

477-1775-009

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962011966104

NSN

5962-01-196-6104

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477-1775-009

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962011966104

NSN

5962-01-196-6104

MFG

BOEING COMPANY THE DBA BOEING DIV DEFENSE SPACE & SECURITY - NETWORK & SPACE SYSTEMS

Description

(NON-CORE DATA) BIT QUANTITY: 1024
(NON-CORE DATA) WORD QUANTITY: 256
CRITICALITY CODE JUSTIFICATION: FEAT
FEATURES PROVIDED: ELECTROSTATIC SENSITIVE AND DIELECTRIC ISOLATED AND BIPOLAR AND 3-STATE OUTPUT AND MONOLITHIC AND RADIATION HARDENED AND PROGRAMMABLE
III END ITEM IDENTIFICATION: PEACEKEEPER IMU
INCLOSURE CONFIGURATION: FLAT PACK
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
SPECIAL FEATURES: ELECTROSTATIC DISCHARGE SENSITIVE AND NUCLEAR HARDNESS CRITICAL ITEM
STORAGE TEMP RANGE: -65.0 TO 175.0 DEG CELSIUS

550255-04

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962011966106

NSN

5962-01-196-6106

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550255-04

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962011966106

NSN

5962-01-196-6106

MFG

BAE SYSTEMS CONTROLS INC

Description

(NON-CORE DATA) BIT QUANTITY: 8192
(NON-CORE DATA) WORD QUANTITY: 1024
FEATURES PROVIDED: MONOLITHIC AND PROGRAMMED
III END ITEM IDENTIFICATION: KC135

550255-06

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962011966106

NSN

5962-01-196-6106

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550255-06

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962011966106

NSN

5962-01-196-6106

MFG

BAE SYSTEMS CONTROLS INC

Description

(NON-CORE DATA) BIT QUANTITY: 8192
(NON-CORE DATA) WORD QUANTITY: 1024
FEATURES PROVIDED: MONOLITHIC AND PROGRAMMED
III END ITEM IDENTIFICATION: KC135

477-1833-001

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962011966109

NSN

5962-01-196-6109

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477-1833-001

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962011966109

NSN

5962-01-196-6109

MFG

BOEING COMPANY THE DBA BOEING DIV DEFENSE SPACE & SECURITY - NETWORK & SPACE SYSTEMS

Description

III END ITEM IDENTIFICATION: B-1B
MANUFACTURERS CODE: 94756
MFR SOURCE CONTROLLING REFERENCE: 477-1833-001
SPEC/STD CONTROLLING DATA:

83000-619

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962011966109

NSN

5962-01-196-6109

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83000-619

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962011966109

NSN

5962-01-196-6109

MFG

DATA DEVICE CORPORATION

Description

III END ITEM IDENTIFICATION: B-1B
MANUFACTURERS CODE: 94756
MFR SOURCE CONTROLLING REFERENCE: 477-1833-001
SPEC/STD CONTROLLING DATA:

CP9843-001

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962011966109

NSN

5962-01-196-6109

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CP9843-001

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962011966109

NSN

5962-01-196-6109

MFG

MICRO-PRECISION TECHNOLOGIES INC.

Description

III END ITEM IDENTIFICATION: B-1B
MANUFACTURERS CODE: 94756
MFR SOURCE CONTROLLING REFERENCE: 477-1833-001
SPEC/STD CONTROLLING DATA:

3130748G001

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962011966112

NSN

5962-01-196-6112

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3130748G001

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962011966112

NSN

5962-01-196-6112

MFG

ITT CORPORATION

HTS-0010SDB

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962011966112

NSN

5962-01-196-6112

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HTS-0010SDB

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962011966112

NSN

5962-01-196-6112

MFG

ANALOG DEVICES INC. DIV CORPORATE HEADQUARTERS

53S3281J/883B

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962011966113

NSN

5962-01-196-6113

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53S3281J/883B

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962011966113

NSN

5962-01-196-6113

MFG

MMI/AMD

Description

(NON-CORE DATA) BIT QUANTITY: 32768
(NON-CORE DATA) WORD QUANTITY: 4096
BODY HEIGHT: 0.210 INCHES MAXIMUM
BODY LENGTH: 1.290 INCHES MAXIMUM
BODY WIDTH: 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM
CASE OUTLINE SOURCE AND DESIGNATOR: D-3 MIL-M-38510
CURRENT RATING PER CHARACTERISTIC: 100.00 MILLIAMPERES NOMINAL OUTPUT
DEFINITIVE GOVERNMENT SPEC/STD REFERENCE: 8200801JA
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND BIPOLAR AND PROGRAMMABLE
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 14 INPUT
MANUFACTURERS CODE: 67268
MAXIMUM POWER DISSIPATION RATING: 1.04 WATTS
MEMORY DEVICE TYPE: ROM
NON-DEFINITIVE GOVERNMENT SPEC/STD REFERENCE: 82008
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: BIPOLAR METAL-OXIDE SEMICONDUCTOR
SPEC/STD CONTROLLING DATA:
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 24 PRINTED CIRCUIT
TEST DATA DOCUMENT: 14933-82008 DRAWING
TIME RATING PER CHACTERISTIC: 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 5.0 VOLTS MAXIMUM POWER SOURCE

82008

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962011966113

NSN

5962-01-196-6113

View More Info

82008

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962011966113

NSN

5962-01-196-6113

MFG

DLA LAND AND MARITIME OPNS SUPPORT GROUP DOCUMENT CONTROL UNIT

Description

(NON-CORE DATA) BIT QUANTITY: 32768
(NON-CORE DATA) WORD QUANTITY: 4096
BODY HEIGHT: 0.210 INCHES MAXIMUM
BODY LENGTH: 1.290 INCHES MAXIMUM
BODY WIDTH: 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM
CASE OUTLINE SOURCE AND DESIGNATOR: D-3 MIL-M-38510
CURRENT RATING PER CHARACTERISTIC: 100.00 MILLIAMPERES NOMINAL OUTPUT
DEFINITIVE GOVERNMENT SPEC/STD REFERENCE: 8200801JA
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND BIPOLAR AND PROGRAMMABLE
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 14 INPUT
MANUFACTURERS CODE: 67268
MAXIMUM POWER DISSIPATION RATING: 1.04 WATTS
MEMORY DEVICE TYPE: ROM
NON-DEFINITIVE GOVERNMENT SPEC/STD REFERENCE: 82008
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: BIPOLAR METAL-OXIDE SEMICONDUCTOR
SPEC/STD CONTROLLING DATA:
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 24 PRINTED CIRCUIT
TEST DATA DOCUMENT: 14933-82008 DRAWING
TIME RATING PER CHACTERISTIC: 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 5.0 VOLTS MAXIMUM POWER SOURCE

8200801JA

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962011966113

NSN

5962-01-196-6113

View More Info

8200801JA

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962011966113

NSN

5962-01-196-6113

MFG

DLA LAND AND MARITIME OPNS SUPPORT GROUP DOCUMENT CONTROL UNIT

Description

(NON-CORE DATA) BIT QUANTITY: 32768
(NON-CORE DATA) WORD QUANTITY: 4096
BODY HEIGHT: 0.210 INCHES MAXIMUM
BODY LENGTH: 1.290 INCHES MAXIMUM
BODY WIDTH: 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM
CASE OUTLINE SOURCE AND DESIGNATOR: D-3 MIL-M-38510
CURRENT RATING PER CHARACTERISTIC: 100.00 MILLIAMPERES NOMINAL OUTPUT
DEFINITIVE GOVERNMENT SPEC/STD REFERENCE: 8200801JA
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND BIPOLAR AND PROGRAMMABLE
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 14 INPUT
MANUFACTURERS CODE: 67268
MAXIMUM POWER DISSIPATION RATING: 1.04 WATTS
MEMORY DEVICE TYPE: ROM
NON-DEFINITIVE GOVERNMENT SPEC/STD REFERENCE: 82008
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: BIPOLAR METAL-OXIDE SEMICONDUCTOR
SPEC/STD CONTROLLING DATA:
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 24 PRINTED CIRCUIT
TEST DATA DOCUMENT: 14933-82008 DRAWING
TIME RATING PER CHACTERISTIC: 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 5.0 VOLTS MAXIMUM POWER SOURCE

8200801JB

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962011966113

NSN

5962-01-196-6113

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8200801JB

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962011966113

NSN

5962-01-196-6113

MFG

DLA LAND AND MARITIME OPNS SUPPORT GROUP DOCUMENT CONTROL UNIT

Description

(NON-CORE DATA) BIT QUANTITY: 32768
(NON-CORE DATA) WORD QUANTITY: 4096
BODY HEIGHT: 0.210 INCHES MAXIMUM
BODY LENGTH: 1.290 INCHES MAXIMUM
BODY WIDTH: 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM
CASE OUTLINE SOURCE AND DESIGNATOR: D-3 MIL-M-38510
CURRENT RATING PER CHARACTERISTIC: 100.00 MILLIAMPERES NOMINAL OUTPUT
DEFINITIVE GOVERNMENT SPEC/STD REFERENCE: 8200801JA
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND BIPOLAR AND PROGRAMMABLE
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 14 INPUT
MANUFACTURERS CODE: 67268
MAXIMUM POWER DISSIPATION RATING: 1.04 WATTS
MEMORY DEVICE TYPE: ROM
NON-DEFINITIVE GOVERNMENT SPEC/STD REFERENCE: 82008
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: BIPOLAR METAL-OXIDE SEMICONDUCTOR
SPEC/STD CONTROLLING DATA:
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 24 PRINTED CIRCUIT
TEST DATA DOCUMENT: 14933-82008 DRAWING
TIME RATING PER CHACTERISTIC: 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 5.0 VOLTS MAXIMUM POWER SOURCE

8200801JX

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962011966113

NSN

5962-01-196-6113

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8200801JX

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962011966113

NSN

5962-01-196-6113

MFG

DLA LAND AND MARITIME OPNS SUPPORT GROUP DOCUMENT CONTROL UNIT

Description

(NON-CORE DATA) BIT QUANTITY: 32768
(NON-CORE DATA) WORD QUANTITY: 4096
BODY HEIGHT: 0.210 INCHES MAXIMUM
BODY LENGTH: 1.290 INCHES MAXIMUM
BODY WIDTH: 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM
CASE OUTLINE SOURCE AND DESIGNATOR: D-3 MIL-M-38510
CURRENT RATING PER CHARACTERISTIC: 100.00 MILLIAMPERES NOMINAL OUTPUT
DEFINITIVE GOVERNMENT SPEC/STD REFERENCE: 8200801JA
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND BIPOLAR AND PROGRAMMABLE
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 14 INPUT
MANUFACTURERS CODE: 67268
MAXIMUM POWER DISSIPATION RATING: 1.04 WATTS
MEMORY DEVICE TYPE: ROM
NON-DEFINITIVE GOVERNMENT SPEC/STD REFERENCE: 82008
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: BIPOLAR METAL-OXIDE SEMICONDUCTOR
SPEC/STD CONTROLLING DATA:
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 24 PRINTED CIRCUIT
TEST DATA DOCUMENT: 14933-82008 DRAWING
TIME RATING PER CHACTERISTIC: 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 5.0 VOLTS MAXIMUM POWER SOURCE

82008B1JB

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962011966113

NSN

5962-01-196-6113

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82008B1JB

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962011966113

NSN

5962-01-196-6113

MFG

DLA LAND AND MARITIME

Description

(NON-CORE DATA) BIT QUANTITY: 32768
(NON-CORE DATA) WORD QUANTITY: 4096
BODY HEIGHT: 0.210 INCHES MAXIMUM
BODY LENGTH: 1.290 INCHES MAXIMUM
BODY WIDTH: 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM
CASE OUTLINE SOURCE AND DESIGNATOR: D-3 MIL-M-38510
CURRENT RATING PER CHARACTERISTIC: 100.00 MILLIAMPERES NOMINAL OUTPUT
DEFINITIVE GOVERNMENT SPEC/STD REFERENCE: 8200801JA
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND BIPOLAR AND PROGRAMMABLE
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 14 INPUT
MANUFACTURERS CODE: 67268
MAXIMUM POWER DISSIPATION RATING: 1.04 WATTS
MEMORY DEVICE TYPE: ROM
NON-DEFINITIVE GOVERNMENT SPEC/STD REFERENCE: 82008
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: BIPOLAR METAL-OXIDE SEMICONDUCTOR
SPEC/STD CONTROLLING DATA:
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 24 PRINTED CIRCUIT
TEST DATA DOCUMENT: 14933-82008 DRAWING
TIME RATING PER CHACTERISTIC: 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 5.0 VOLTS MAXIMUM POWER SOURCE

82HS321A/BJA

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962011966113

NSN

5962-01-196-6113

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82HS321A/BJA

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962011966113

NSN

5962-01-196-6113

MFG

PHILIPS SEMICONDUCTORS INC

Description

(NON-CORE DATA) BIT QUANTITY: 32768
(NON-CORE DATA) WORD QUANTITY: 4096
BODY HEIGHT: 0.210 INCHES MAXIMUM
BODY LENGTH: 1.290 INCHES MAXIMUM
BODY WIDTH: 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM
CASE OUTLINE SOURCE AND DESIGNATOR: D-3 MIL-M-38510
CURRENT RATING PER CHARACTERISTIC: 100.00 MILLIAMPERES NOMINAL OUTPUT
DEFINITIVE GOVERNMENT SPEC/STD REFERENCE: 8200801JA
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND BIPOLAR AND PROGRAMMABLE
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 14 INPUT
MANUFACTURERS CODE: 67268
MAXIMUM POWER DISSIPATION RATING: 1.04 WATTS
MEMORY DEVICE TYPE: ROM
NON-DEFINITIVE GOVERNMENT SPEC/STD REFERENCE: 82008
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: BIPOLAR METAL-OXIDE SEMICONDUCTOR
SPEC/STD CONTROLLING DATA:
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 24 PRINTED CIRCUIT
TEST DATA DOCUMENT: 14933-82008 DRAWING
TIME RATING PER CHACTERISTIC: 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 5.0 VOLTS MAXIMUM POWER SOURCE

AM27S43/BJA

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962011966113

NSN

5962-01-196-6113

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AM27S43/BJA

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962011966113

NSN

5962-01-196-6113

MFG

ADVANCED MICRO DEVICES INC DBA A M D

Description

(NON-CORE DATA) BIT QUANTITY: 32768
(NON-CORE DATA) WORD QUANTITY: 4096
BODY HEIGHT: 0.210 INCHES MAXIMUM
BODY LENGTH: 1.290 INCHES MAXIMUM
BODY WIDTH: 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM
CASE OUTLINE SOURCE AND DESIGNATOR: D-3 MIL-M-38510
CURRENT RATING PER CHARACTERISTIC: 100.00 MILLIAMPERES NOMINAL OUTPUT
DEFINITIVE GOVERNMENT SPEC/STD REFERENCE: 8200801JA
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND BIPOLAR AND PROGRAMMABLE
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 14 INPUT
MANUFACTURERS CODE: 67268
MAXIMUM POWER DISSIPATION RATING: 1.04 WATTS
MEMORY DEVICE TYPE: ROM
NON-DEFINITIVE GOVERNMENT SPEC/STD REFERENCE: 82008
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: BIPOLAR METAL-OXIDE SEMICONDUCTOR
SPEC/STD CONTROLLING DATA:
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 24 PRINTED CIRCUIT
TEST DATA DOCUMENT: 14933-82008 DRAWING
TIME RATING PER CHACTERISTIC: 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 5.0 VOLTS MAXIMUM POWER SOURCE

R29671DM/883B

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962011966113

NSN

5962-01-196-6113

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R29671DM/883B

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962011966113

NSN

5962-01-196-6113

MFG

FAIRCHILD SEMICONDUCTOR CORP SEMICONDUCTOR DIV HQ

Description

(NON-CORE DATA) BIT QUANTITY: 32768
(NON-CORE DATA) WORD QUANTITY: 4096
BODY HEIGHT: 0.210 INCHES MAXIMUM
BODY LENGTH: 1.290 INCHES MAXIMUM
BODY WIDTH: 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM
CASE OUTLINE SOURCE AND DESIGNATOR: D-3 MIL-M-38510
CURRENT RATING PER CHARACTERISTIC: 100.00 MILLIAMPERES NOMINAL OUTPUT
DEFINITIVE GOVERNMENT SPEC/STD REFERENCE: 8200801JA
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND BIPOLAR AND PROGRAMMABLE
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 14 INPUT
MANUFACTURERS CODE: 67268
MAXIMUM POWER DISSIPATION RATING: 1.04 WATTS
MEMORY DEVICE TYPE: ROM
NON-DEFINITIVE GOVERNMENT SPEC/STD REFERENCE: 82008
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: BIPOLAR METAL-OXIDE SEMICONDUCTOR
SPEC/STD CONTROLLING DATA:
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 24 PRINTED CIRCUIT
TEST DATA DOCUMENT: 14933-82008 DRAWING
TIME RATING PER CHACTERISTIC: 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 5.0 VOLTS MAXIMUM POWER SOURCE