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5962-01-187-0842

20 Products

LF351AH/A+

MICROCIRCUIT,LINEAR

NSN, MFG P/N

5962011870842

NSN

5962-01-187-0842

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LF351AH/A+

MICROCIRCUIT,LINEAR

NSN, MFG P/N

5962011870842

NSN

5962-01-187-0842

MFG

NATIONAL SEMICONDUCTOR CORPORATION

Description

BODY HEIGHT: 0.165 INCHES MINIMUM AND 0.185 INCHES MAXIMUM
BODY OUTSIDE DIAMETER: 0.350 INCHES MINIMUM AND 0.370 INCHES MAXIMUM
CASE OUTLINE SOURCE AND DESIGNATOR: TO-5 JOINT ELECTRON DEVICE ENGINEERING COUNCIL
DESIGN FUNCTION AND QUANTITY: 1 AMPLIFIER, OPERATIONAL, HIGH SPEED
FEATURES PROVIDED: BURN IN, MIL-STD-883, CLASS A AND FAST SETTLING AND HERMETICALLY SEALED AND HIGH IMPEDANCE AND INTERNALLY TRIMMED AND LOW BIAS AND LOW CURRENT AND LOW NOISE
INCLOSURE CONFIGURATION: CAN
INCLOSURE MATERIAL: METAL
INPUT CIRCUIT PATTERN: 2 INPUT
OPERATING TEMP RANGE: 0.0 TO 70.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER

8300-280

MICROCIRCUIT,LINEAR

NSN, MFG P/N

5962011870307

NSN

5962-01-187-0307

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8300-280

MICROCIRCUIT,LINEAR

NSN, MFG P/N

5962011870307

NSN

5962-01-187-0307

MFG

HYTEK MICROSYSTEMS INC.

Description

BODY HEIGHT: 0.350 INCHES NOMINAL
BODY LENGTH: 1.595 INCHES MAXIMUM
BODY WIDTH: 1.095 INCHES MAXIMUM
DESIGN FUNCTION AND QUANTITY: 1 OSCILLATOR, LINEAR
FEATURES PROVIDED: HYBRID AND BURN IN AND MONOLITHIC
III OVERALL HEIGHT: 0.445 INCHES MINIMUM AND 0.465 INCHES MAXIMUM
INCLOSURE CONFIGURATION: CAN
INCLOSURE MATERIAL: CERAMIC OR GLASS
INPUT CIRCUIT PATTERN: 1 INPUT
MAXIMUM POWER DISSIPATION RATING: 700.0 MILLIWATTS
OPERATING TEMP RANGE: -54.0 TO 85.0 DEG CELSIUS
STORAGE TEMP RANGE: -62.0 TO 125.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD

1040856

MICROCIRCUIT

NSN, MFG P/N

5962011870308

NSN

5962-01-187-0308

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1040856

MICROCIRCUIT

NSN, MFG P/N

5962011870308

NSN

5962-01-187-0308

MFG

PALOMAR PRODUCTS INC.

728000-116

MICROCIRCUIT

NSN, MFG P/N

5962011870308

NSN

5962-01-187-0308

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728000-116

MICROCIRCUIT

NSN, MFG P/N

5962011870308

NSN

5962-01-187-0308

MFG

RAYTHEON COMPANY DBA RAYTHEON

1826-0955

MICROCIRCUIT,LINEAR

NSN, MFG P/N

5962011870572

NSN

5962-01-187-0572

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1826-0955

MICROCIRCUIT,LINEAR

NSN, MFG P/N

5962011870572

NSN

5962-01-187-0572

MFG

AGILENT TECHNOLOGIES INC. DBA NORTH AMERICAN CONTACT CENTER DIV AGILENT BUSINESS CENTER

1DB6

MICROCIRCUIT,LINEAR

NSN, MFG P/N

5962011870572

NSN

5962-01-187-0572

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1DB6

MICROCIRCUIT,LINEAR

NSN, MFG P/N

5962011870572

NSN

5962-01-187-0572

MFG

AGILENT TECHNOLOGIES INC DBA AGILENT SANTA CLARA SITE DIV SANTA CLARA SITE

19-10035-00

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962011870573

NSN

5962-01-187-0573

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19-10035-00

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962011870573

NSN

5962-01-187-0573

MFG

COMPAQ FEDERAL LLC

Description

INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC
OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC

725000-808

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962011870574

NSN

5962-01-187-0574

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725000-808

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962011870574

NSN

5962-01-187-0574

MFG

RAYTHEON COMPANY DBA RAYTHEON

AM25S05DM-B

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962011870574

NSN

5962-01-187-0574

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AM25S05DM-B

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962011870574

NSN

5962-01-187-0574

MFG

ADVANCED MICRO DEVICES INC DBA A M D

G125385-1

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962011870576

NSN

5962-01-187-0576

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G125385-1

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962011870576

NSN

5962-01-187-0576

MFG

RAYTHEON TECHNICAL SERVICES COMPANY LLC DBA RAYTHEON

MD8155HB

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962011870576

NSN

5962-01-187-0576

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MD8155HB

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962011870576

NSN

5962-01-187-0576

MFG

ADVANCED MICRO DEVICES INC DBA A M D

CD4053AD/883B

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962011870577

NSN

5962-01-187-0577

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CD4053AD/883B

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962011870577

NSN

5962-01-187-0577

MFG

INTERSIL CORPORATION

CD4053BD3

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962011870577

NSN

5962-01-187-0577

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CD4053BD3

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962011870577

NSN

5962-01-187-0577

MFG

INTERSIL CORPORATION

CD4053BMJ/883

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962011870577

NSN

5962-01-187-0577

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CD4053BMJ/883

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962011870577

NSN

5962-01-187-0577

MFG

NATIONAL SEMICONDUCTOR CORPORATION

CD4053MD/883B

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962011870577

NSN

5962-01-187-0577

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CD4053MD/883B

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962011870577

NSN

5962-01-187-0577

MFG

NATIONAL SEMICONDUCTOR CORPORATION

F34053DMQB

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962011870577

NSN

5962-01-187-0577

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F34053DMQB

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962011870577

NSN

5962-01-187-0577

MFG

FAIRCHILD SEMICONDUCTOR CORP

SCL4053BC

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962011870577

NSN

5962-01-187-0577

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SCL4053BC

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962011870577

NSN

5962-01-187-0577

MFG

ALLEGRO MICROSYSTEMS INC

SM-A-838186

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962011870577

NSN

5962-01-187-0577

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SM-A-838186

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962011870577

NSN

5962-01-187-0577

MFG

US ARMY COMMUNICATIONS & ELECTRONICS MATERIEL READINESS COMMAND LOGISTICS ENGINEERING DIR

805547-1

MICROCIRCUIT,LINEAR

NSN, MFG P/N

5962011870841

NSN

5962-01-187-0841

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805547-1

MICROCIRCUIT,LINEAR

NSN, MFG P/N

5962011870841

NSN

5962-01-187-0841

MFG

RAYTHEON COMPANY

Description

BODY HEIGHT: 0.205 INCHES MAXIMUM
BODY LENGTH: 1.290 INCHES MAXIMUM
BODY WIDTH: 0.570 INCHES MAXIMUM
FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: TIN

C411/883B

MICROCIRCUIT,LINEAR

NSN, MFG P/N

5962011870841

NSN

5962-01-187-0841

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C411/883B

MICROCIRCUIT,LINEAR

NSN, MFG P/N

5962011870841

NSN

5962-01-187-0841

MFG

INTRONICS INCORPORATED

Description

BODY HEIGHT: 0.205 INCHES MAXIMUM
BODY LENGTH: 1.290 INCHES MAXIMUM
BODY WIDTH: 0.570 INCHES MAXIMUM
FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: TIN