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5961-01-566-2749

20 Products

106-5007-000

SEMICONDUCTOR DEVICE,DIODE

NSN, MFG P/N

5961015662749

NSN

5961-01-566-2749

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106-5007-000

SEMICONDUCTOR DEVICE,DIODE

NSN, MFG P/N

5961015662749

NSN

5961-01-566-2749

MFG

SIKORSKY AIRCRAFT CORPORATION

Description

III END ITEM IDENTIFICATION: CIRCUIT CARD ASSEMBLY
III PART NAME ASSIGNED BY CONTROLLING AGENCY: DIODE
INCLOSURE MATERIAL: GLASS
SEMICONDUCTOR MATERIAL: SILICON

JANTXV1N4574A-1

SEMICONDUCTOR DEVICE,DIODE

NSN, MFG P/N

5961015652326

NSN

5961-01-565-2326

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JANTXV1N4574A-1

SEMICONDUCTOR DEVICE,DIODE

NSN, MFG P/N

5961015652326

NSN

5961-01-565-2326

MFG

MICROSEMI CORP. - MASSACHUSETTS DBA MICROSEMI-LAWRENCE DIV MICROSEMI CORPORATION

Description

CURRENT RATING PER CHARACTERISTIC: 70.00 MILLIAMPERES MAXIMUM MAXIMUM DC CURRENT IN REVERSE BREAKDOWN REGION
DEFINITIVE GOVERNMENT SPEC/STD REFERENCE: JANTXV1N4574A-1
FEATURES PROVIDED: HERMETICALLY SEALED CASE
INCLOSURE MATERIAL: GLASS
JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION: DO-35
MANUFACTURERS CODE: 81349
MAXIMUM OPERATING TEMP PER MEASUREMENT POINT: 175.0 DEG CELSIUS AMBIENT AIR
MOUNTING METHOD: TERMINAL
NON-DEFINITIVE GOVERNMENT SPEC/STD REFERENCE: MIL-PRF-19500/452
OVERALL LENGTH: 2.120 INCHES MINIMUM
POWER RATING PER CHARACTERISTIC: 475.0 MILLIWATTS MAXIMUM TOTAL POWER DISSIPATION
SEMICONDUCTOR MATERIAL: SILICON
SPEC/STD CONTROLLING DATA:
SPECIFICATION/STANDARD DATA: 81349-MIL-PRF-19500/452 GOVERNMENT SPECIFICATION
TERMINAL CIRCLE DIAMETER: 0.018 INCHES MINIMUM AND 0.023 INCHES MAXIMUM
TERMINAL LENGTH: 1.000 INCHES MINIMUM AND 1.500 INCHES MAXIMUM
TERMINAL TYPE AND QUANTITY: 2 UNINSULATED WIRE LEAD
VOLTAGE RATING IN VOLTS PER CHARACTERISTIC: 6.7 MAXIMUM REGULATOR VOLTAGE, DC
VOLTAGE TOLERANCE IN PERCENT: -5.0 TO 5.0

906-50037-111

SEMICONDUCTOR DEVICE,DIODE

NSN, MFG P/N

5961015652568

NSN

5961-01-565-2568

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906-50037-111

SEMICONDUCTOR DEVICE,DIODE

NSN, MFG P/N

5961015652568

NSN

5961-01-565-2568

MFG

THE BOEING COMPANY DBA BOEING

MURD320T4

SEMICONDUCTOR DEVICE,DIODE

NSN, MFG P/N

5961015652568

NSN

5961-01-565-2568

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MURD320T4

SEMICONDUCTOR DEVICE,DIODE

NSN, MFG P/N

5961015652568

NSN

5961-01-565-2568

MFG

SEMICONDUCTOR COMPONENTS INDUSTRIES LLC DBA SEMI CONDUCTOR COMPONENTS INDUSTRIES DIV CORPORATE HEADQUARTERS

11440371

SEMICONDUCTOR DEVICE ASSEMBLY

NSN, MFG P/N

5961015652834

NSN

5961-01-565-2834

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11440371

SEMICONDUCTOR DEVICE ASSEMBLY

NSN, MFG P/N

5961015652834

NSN

5961-01-565-2834

MFG

U S ARMY AVIATION AND MISSILE COMMAND

201498-001

RECTIFIER,SEMICONDUCTOR DEVICE

NSN, MFG P/N

5961015653053

NSN

5961-01-565-3053

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201498-001

RECTIFIER,SEMICONDUCTOR DEVICE

NSN, MFG P/N

5961015653053

NSN

5961-01-565-3053

MFG

SUPERIOR ELECTRIC HOLDING GROUP LLC DBA SUPERIOR ELECTRIC DIV DANAHER SENSORS & CONTROLS

Description

III END ITEM IDENTIFICATION: REGULAR, VOLTAGE
SPECIAL FEATURES: DESCRIPTION: RECTIFIER ASSEMBLY, 30A, 200V

JANTXV1N6475

SEMICONDUCTOR DEVICE,DIODE

NSN, MFG P/N

5961015653657

NSN

5961-01-565-3657

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JANTXV1N6475

SEMICONDUCTOR DEVICE,DIODE

NSN, MFG P/N

5961015653657

NSN

5961-01-565-3657

MFG

MILITARY SPECIFICATIONS PROMULGATED BY MILITARY DEPARTMENTS/AGENCIES UNDER AUTHORITY OF DEFENSE STANDARDIZATION MANUAL 4120 3-M

Description

CURRENT RATING PER CHARACTERISTIC: 2.00 MILLIAMPERES NOMINAL DRAIN CURRENT
DEFINITIVE GOVERNMENT SPEC/STD REFERENCE: JANTXV1N6475
FEATURES PROVIDED: HERMETICALLY SEALED CASE
III END ITEM IDENTIFICATION: EUROFIGHTER 2000,EFA
INCLOSURE MATERIAL: PLASTIC
MANUFACTURERS CODE: 81349
MOUNTING METHOD: TERMINAL
NON-DEFINITIVE GOVERNMENT SPEC/STD REFERENCE: MIL-PRF-19500/552
OVERALL DIAMETER: 0.185 INCHES MAXIMUM
OVERALL LENGTH: 0.395 INCHES NOMINAL
SEMICONDUCTOR MATERIAL: SILICON
SPEC/STD CONTROLLING DATA:
TERMINAL TYPE AND QUANTITY: 2 UNINSULATED WIRE LEAD
VOLTAGE RATING IN VOLTS PER CHARACTERISTIC: 43.7 MINIMUM BREAKDOWN VOLTAGE, DC

PD55F120

SEMICONDUCTOR DEVICE,THYRISTOR

NSN, MFG P/N

5961015653939

NSN

5961-01-565-3939

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PD55F120

SEMICONDUCTOR DEVICE,THYRISTOR

NSN, MFG P/N

5961015653939

NSN

5961-01-565-3939

MFG

SANREX CORP

Description

FUNCTION FOR WHICH DESIGNED: RECTIFIER
MOUNTING METHOD: BRACKET
SPECIAL FEATURES: DESIGNED FOR VARIOUS RECTIFICER CIRCUITS AND POWER CONTROLS

2N6678

SEMICONDUCTOR DEVICE,DIODE

NSN, MFG P/N

5961015654550

NSN

5961-01-565-4550

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2N6678

SEMICONDUCTOR DEVICE,DIODE

NSN, MFG P/N

5961015654550

NSN

5961-01-565-4550

MFG

MICROSEMI MICROWAVE PRODUCTS INC

Description

III PART NAME ASSIGNED BY CONTROLLING AGENCY: POWER SILICON TRANSISTOR
MOUNTING METHOD: UNTHREADED HOLE

M15454-13

RECTIFIER,SEMICONDUCTOR DEVICE

NSN, MFG P/N

5961015656961

NSN

5961-01-565-6961

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M15454-13

RECTIFIER,SEMICONDUCTOR DEVICE

NSN, MFG P/N

5961015656961

NSN

5961-01-565-6961

MFG

LINCOLN ELECTRIC HOLDINGS INC.

Description

III END ITEM IDENTIFICATION: WELDING MACHINE POWER WAVE 455
PART NAME ASSIGNED BY CONTROLLING AGENCY: DIODE, BRIDGE
SPECIAL FEATURES: 160A, 1600V, F-W, 3PH

1N6065A

SEMICONDUCTOR DEVICE,DIODE

NSN, MFG P/N

5961015657191

NSN

5961-01-565-7191

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1N6065A

SEMICONDUCTOR DEVICE,DIODE

NSN, MFG P/N

5961015657191

NSN

5961-01-565-7191

MFG

MILITARY SPECIFICATIONS PROMULGATED BY MILITARY DEPARTMENTS/AGENCIES UNDER AUTHORITY OF DEFENSE STANDARDIZATION MANUAL 4120 3-M

Description

CURRENT RATING PER CHARACTERISTIC: 50.00 AMPERES NOMINAL PEAK PULSE CURRENT
DEFINITIVE GOVERNMENT SPEC/STD REFERENCE: 1N6065A
INCLOSURE MATERIAL: GLASS AND METAL
JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION: DO-13
MANUFACTURERS CODE: 81349
MOUNTING FACILITY QUANTITY: 2
MOUNTING METHOD: UNTHREADED HOLE
NON-DEFINITIVE GOVERNMENT SPEC/STD REFERENCE: MIL-PRF-19500/507
OVERALL DIAMETER: 0.235 INCHES MAXIMUM
OVERALL LENGTH: 0.333 INCHES NOMINAL
SEMICONDUCTOR MATERIAL: SILICON
SPEC/STD CONTROLLING DATA:
TERMINAL TYPE AND QUANTITY: 2 UNINSULATED WIRE LEAD
VOLTAGE RATING IN VOLTS PER CHARACTERISTIC: 120.0 NOMINAL BREAKDOWN VOLTAGE, DC AND 100.0 NOMINAL WORKING PEAK REVERSE VOLTAGE

BSS84

TRANSISTOR

NSN, MFG P/N

5961015657716

NSN

5961-01-565-7716

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BSS84

TRANSISTOR

NSN, MFG P/N

5961015657716

NSN

5961-01-565-7716

MFG

FAIRCHILD SEMICONDUCTOR CORP

Description

MAXIMUM OPERATING TEMP PER MEASUREMENT POINT: 150.0 DEG CELSIUS JUNCTION
MOUNTING FACILITY QUANTITY: 3
MOUNTING METHOD: TERMINAL
POWER RATING PER CHARACTERISTIC: 0.36 WATTS MAXIMUM TOTAL DEVICE DISSIPATION
SPECIAL FEATURES: P-CHANNEL MODE FIELD EFFECT; HIGH DENSITY CELL; HIGHT SATURATION CURRENT
TERMINAL TYPE AND QUANTITY: 3 TAB, SOLDER LUG
VOLTAGE RATING IN VOLTS PER CHARACTERISTIC: 20.0 MAXIMUM GATE TO SOURCE VOLTAGE

MA47220-144

SEMICONDUCTOR DEVICE,DIODE

NSN, MFG P/N

5961015658045

NSN

5961-01-565-8045

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MA47220-144

SEMICONDUCTOR DEVICE,DIODE

NSN, MFG P/N

5961015658045

NSN

5961-01-565-8045

MFG

M/A-COM INC. DBA TYCO ELECTRONIC WIRELESS SYSTEM

SVT300-5

TRANSISTOR

NSN, MFG P/N

5961015659281

NSN

5961-01-565-9281

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SVT300-5

TRANSISTOR

NSN, MFG P/N

5961015659281

NSN

5961-01-565-9281

MFG

SEMICONDUCTOR TECHNOLOGY INC DBA S T I

Description

CRITICALITY CODE JUSTIFICATION: AGAV
CURRENT RATING PER CHARACTERISTIC: 20.00 AMPERES MAXIMUM COLLECTOR CURRENT, DC
FEATURES PROVIDED: HERMETICALLY SEALED CASE
III END ITEM IDENTIFICATION: 25F AIRCRAFT, AWACS, E-3A; EZN TICONDEROGA CLASS CG(47); JDN ARLEIGH BURKE CLASS DDG; SZN 2M/ATE MICROMINIATURE TEST EQUIPMENT
INCLOSURE MATERIAL: METAL
INTERNAL CONFIGURATION: JUNCTION CONTACT
JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION: TO-3
MOUNTING METHOD: TERMINAL
OVERALL LENGTH: 0.250 INCHES MINIMUM AND 0.450 INCHES MAXIMUM
OVERALL WIDTH ACROSS FLATS: 0.667 INCHES MINIMUM
POWER RATING PER CHARACTERISTIC: 150.0 WATTS MAXIMUM TOTAL POWER DISSIPATION
SEMICONDUCTOR MATERIAL: SILICON
SPECIAL FEATURES: JUNCTION PATTERN ARRANGEMENT: NPN
TERMINAL TYPE AND QUANTITY: 2 PIN
TEST DATA DOCUMENT: 21908-167-0043-001 DRAWING
VOLTAGE RATING IN VOLTS PER CHARACTERISTIC: 325.0 MAXIMUM COLLECTOR TO BASE VOLTAGE/STATIC/EMITTER OPEN AND 300.0 MAXIMUM COLLECTOR TO EMITTER VOLTAGE/STATIC/BASE OPEN AND 6.0 MAXIMUM BREAKDOWN VOLTAGE, COLLECTOR-TO-BASE, EMITTER OPEN

3581041

SEMICONDUCTOR DEVICE,DIODE

NSN, MFG P/N

5961015659515

NSN

5961-01-565-9515

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3581041

SEMICONDUCTOR DEVICE,DIODE

NSN, MFG P/N

5961015659515

NSN

5961-01-565-9515

MFG

OSHKOSH CORPORATION

1047533

SEMICONDUCTOR DEVICE,DIODE

NSN, MFG P/N

5961015661165

NSN

5961-01-566-1165

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1047533

SEMICONDUCTOR DEVICE,DIODE

NSN, MFG P/N

5961015661165

NSN

5961-01-566-1165

MFG

SCHOTTEL INC.

Description

III END ITEM IDENTIFICATION: DRIVE UNIT, MARINE PROPULSION SRP170
III PART NAME ASSIGNED BY CONTROLLING AGENCY: DIODE
SPECIAL FEATURES: DIODE 1N4007

951184

SEMICONDUCTOR DEVICE,DIODE

NSN, MFG P/N

5961015661503

NSN

5961-01-566-1503

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951184

SEMICONDUCTOR DEVICE,DIODE

NSN, MFG P/N

5961015661503

NSN

5961-01-566-1503

MFG

ESAB GROUP INC THE DBA ESAB WELDING PRODUCTS

Description

III END ITEM IDENTIFICATION: WELDER, DIGIPULSE 450I 31120
III PART NAME ASSIGNED BY CONTROLLING AGENCY: OUTPUT DIODE

106-0053-000

SEMICONDUCTOR DEVICE,DIODE

NSN, MFG P/N

5961015662746

NSN

5961-01-566-2746

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106-0053-000

SEMICONDUCTOR DEVICE,DIODE

NSN, MFG P/N

5961015662746

NSN

5961-01-566-2746

MFG

SIKORSKY AIRCRAFT CORPORATION

Description

III END ITEM IDENTIFICATION: CIRCUIT CARD ASSEMBLY
III PART NAME ASSIGNED BY CONTROLLING AGENCY: DIODE
INCLOSURE MATERIAL: GLASS
SEMICONDUCTOR MATERIAL: SILICON

106-0054-000

SEMICONDUCTOR DEVICE,DIODE

NSN, MFG P/N

5961015662747

NSN

5961-01-566-2747

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106-0054-000

SEMICONDUCTOR DEVICE,DIODE

NSN, MFG P/N

5961015662747

NSN

5961-01-566-2747

MFG

SIKORSKY AIRCRAFT CORPORATION

Description

III END ITEM IDENTIFICATION: CIRCUIT CARD ASSEMBLY
III PART NAME ASSIGNED BY CONTROLLING AGENCY: DIODE
INCLOSURE MATERIAL: GLASS
SEMICONDUCTOR MATERIAL: SILICON

106-5002-000

SEMICONDUCTOR DEVICE,DIODE

NSN, MFG P/N

5961015662748

NSN

5961-01-566-2748

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106-5002-000

SEMICONDUCTOR DEVICE,DIODE

NSN, MFG P/N

5961015662748

NSN

5961-01-566-2748

MFG

SIKORSKY AIRCRAFT CORPORATION

Description

III END ITEM IDENTIFICATION: CIRCUIT CARD ASSEMBLY
III PART NAME ASSIGNED BY CONTROLLING AGENCY: DIODE
INCLOSURE MATERIAL: GLASS
SEMICONDUCTOR MATERIAL: SILICON